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Applic Spectroscopic ellipsometry study of thin diffusion barriers of TaN and Ta for Cu interconnects in integrated circuitsRUDRA, S; WÄCHTLER, T; GESSNER, T et al.Physica status solidi. A, Applications and materials science (Print). 2008, Vol 205, Num 4, pp 922-926, issn 1862-6300, 5 p.Conference Paper

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Study of clean and oxygen-covered Ag surfaces using optical reflectance anisotropyFERNANDEZ, V; PAHLKE, D; ESSER, N et al.Surface science. 1997, Vol 377-79, pp 388-392, issn 0039-6028Conference Paper